Optoelectronic component

ABSTRACT

This invention relates to an optoelectronic component which has the following: an optical component which emits optical signals to an input/output end face of a light guide and/or receives optical signals and converts them into electronic signals, a component carrier located on the optical component, and a housing part which surrounds the optical component and which has coupling means which form optical coupling means and mechanical coupling means (alignment means), the optical coupling means routing the optical signals coming from the optical component to the input end face of the light guide and/or routing the optical beams emerging from the input/output end face of the light guide to the optical component, the mechanical alignment means aligning the light guide with respect to the optical component for efficient signal transmission.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a National Phase of Application No.PCT/EP2011/004581 filed Sep. 12, 2011, which claims the benefit ofGerman Patent Application No. 10 2010 044 836.2 filed on Sep. 12, 2010,which are incorporated herein by reference in their entirety.

This invention relates to an optical coupling device and anoptoelectronic component (for example an electro/optical (E/O) converter(transmitter) and/or an optical/electrical (O/E) converter (receiver)and a method for production.

Preferably the invention relates to an optoelectronic transceiver (inshort: an optical transceiver) in which electrical-optical transmittingapparatus (which for example as an optical transmitter element have aVCSEL) and optical/electrical receiving apparatus (which for example asan optical receiving element have a photodiode) are used. While whenusing electrical transceivers the transmitting and receiving informationis [transmitted] between two electrical transceivers by using electricalwaves or signals, when using two optical transceivers the transmittingand receiving information is transmitted by optical waves or signals.

In the reception operating mode of a transceiver it converts the opticalinput signals which are supplied for example by a light guide, forexample a glass fiber and which are transmitted on an opticaltransmission link into electrical signals which are then furtherprocessed in the optical transceiver itself and/or in connectedcircuits.

In the transmission operating mode the transceiver converts electricalinput signals into optical signals which are to be transmitted on theoptical transmission link. To do this the optical transceiver has anoptical element which works as an E/O converter, for example a VCSELlaser.

In an optoelectronic component, for example a transceiver, there is thenecessity of providing relatively efficient optical coupling between theoptical transmitter element and the light guide, especially on the onehand (in the case of transmission) between the E/O converter whichgenerates the optical signals and the light guide, for example betweenthe input end face of a glass fiber, and also on the other hand (in thecase of reception) between the optical signals which emerge from theexit surface of the light guide and which travel to the opticalreceiving element (O/E converter) which generates the electricalsignals.

For example U.S. Pat. No. 6,560,385 discloses an optical couplingarrangement which uses a fiber optic prism 10 and has the following: Asubstrate 20 with at least one light element 24 and at least onewaveguide 22 which is located over a substrate 20, furthermore therebeing a fiber optic prism 10. The fiber optic prism 10 receives lightthrough the first side surface 12, reflects the received light from athird side surface 16 and transmits the reflected light from a thirdside surface 16 through a second side surface 14.

According to FIG. 3, the fiber optic prism 10 is arranged such that thefirst side surface 12 is located adjacent to the light element 24, andthe second side surface 14 is located adjacent to the waveguide 22. Thelight element 24 can have a light-emitting device such as for example aLED or a VCSEL or a light receiving device such as for example aphotodiode. One alternative arrangement is shown in FIG. 4 of the '385patent.

Here it should be pointed out that the fiber optic prism is a separatecomponent which must be produced separately and must also be calibratedwhen it is installed in the transceiver.

The object of this invention is to provide an optoelectronic component,coupling means being provided for an electro/optical transmitter and foran optical/electrical receiver as well as especially for anoptoelectronic transceiver such that the calibration effort for theoptical components, for example the optical element and the light guide,is low.

As claimed in the invention there are optical coupling means and acoupling device which has integrated light guide alignment (preferably1-0 optical fiber alignment) and integrated mirror structures orintegrated mirror properties.

As claimed in the invention the optical coupling means have both opticaland also mechanical coupling means.

They can be made in the form of an optoelectronic semiconductor package,i.e. there is an optoelectronic component housing (semiconductor housingor housing part) which combines the feature of the optical fiberalignment (physical or mechanical light guide alignment) with thefeature of beam deflection which ensures an almost vertical 20 beamincidence into the input end face of the light guide. Preferably thistakes place in the beam deflection by means of collimation.

As claimed in the invention there is an optoelectronic transceiver whichuses this optical coupling device and which can be built to be smallenough to be usable in USB 1.0, 2.0, 3.0 plug-in connector technology.

As claimed in the invention the critical functions of fiber alignmentand beam deflection and collimation are achieved in a single productionstep by molding of the optoelectronic component housing part orsemiconductor housing part which forms the optical coupling device, nofurther active alignment step being necessary.

The optical coupling device which is made as claimed in the invention asa molded plastic body forms a first housing part of a component housingand shapes an enclosure with a second housing part or component carrierwhich bears an optical element. As claimed in the invention preferablythe plastic body is molded directly on the component carrier which bearsthe optical component.

In the component housing or optoelectronic semiconductor housing (alsocalled the semiconductor package) therefore an optical element, forexample in the form of a VCSEL for the driver (optical transmitter)and/or an optical element in the form of a photodiode for the receiver,is accommodated, i.e. forms the optoelectronic semiconductor housingwhen it contains an optical transmitter and/or an optical receiver andoptionally also other electrical circuits, an optoelectronic componentas claimed in the invention, for example, and preferably, a transceiver.

As claimed in the invention the optoelectronic component housing orsemiconductor housing which has the optical coupling device is achievedby efficient coupling between an optical fiber (light guide) and anoptical element (transmitting and/or receiving element) preferably witha 90° beam deflection in that the coupling device provides optical fiberalignment and beam deflection as well as focusing, specifically byproviding or molding a molded highly transparent plastic body whichforms the optical coupling device (coupling means) directly on acomponent carrier which bears the active element(s). The plastic bodyforms the optical coupling means. Preferably the so-called “overmoldpackaging technology” is used for production.

Alternatively other plastic molding processes such as for exampletransfer overmolding with photocurable plastic can also be used.

As claimed in the invention the optoelectronic housing part(semiconductor housing) is made such that the plastic material or theovermold material is highly transparent and when the housing part isformed with a further material of a second housing part or componentcarrier it assumes a mechanical connection. The second housing part, asmentioned, can be a component carrier and bears an optical element andoptionally other components or electrical circuits. The second componentcarrier is for example a substrate or a lead frame or a ceramic. Whenusing the semiconductor housing or the optical component housing whichhas the coupling means as claimed in the invention, for example wheninstalled in a plug-in connector, the latter is durable.

As claimed in the invention the plastic or the overmold plastic materialwhich forms the housing part forms a reflector or reflection mirrorwhich forms a reflection interface, preferably a total reflectioninterface for the light which can be transmitted between the opticalelement(s) positioned on the carrier and the entry end face of the lightguide (and optionally vice versa). Preferably the reflection mirrorwhich forms the reflection interface is an internal conical totalreflection mirror.

As claimed in the invention the plastic on its interface to the ambientair forms the reflection mirror as a result of the transition from theplastic material with a higher index of refraction to the air with anindex of refraction of 1.

Moreover it is preferably provided that the first housing part molded bythe plastic especially by overmolding methods in its molding togetherwith the component carrier forms an optoelectronic component housingwhich surrounds the optical element, i.e. encapsulates it, the opticalcoupling device acting as optical coupling means and mechanical couplingmeans, the latter preferably being provided as alignment means for thelight guide. The alignment means are preferably formed by a V groove inthe housing part. Preferred configurations of the invention will becomeapparent from the claims.

Other advantages, objectives and details of the invention will becomeapparent from the specification and exemplary embodiments using thedrawings.

FIG. 1 shows a schematic side view of an optoelectronic component asclaimed in the invention with an optoelectronic housing (or anoptoelectronic semiconductor package) which has a first and a secondhousing part 10, in which there are an optical element and couplingmeans for light to and/or from a light guide;

FIG. 2 schematically shows two housing parts which are shown pulledapart and which form the housing of the optical component of FIG. 1;

FIG. 3 shows a schematic similar to FIG. 1, here its being assumed thatthe electrooptical component as one configuration of the invention is anoptoelectronic transceiver in which there are an internal conical totalreflection mirror which is formed by the first [sic] from a preferablyhighly transparent plastic for the optical connection between theoptical receiver/optical transmitter and the light guide and furthermorealignment means for the light guide;

FIG. 4 schematically shows an electrooptical converter (transmitter)with its preferred dimensions, in the transmission operating mode alight beam emerging from a VCSEL being collimated and reflected towardone input end face of the light guide by a reflection surface formed bythe first housing part;

FIG. 5 shows a schematic cross section of the optical component,especially of the optical transmitter of FIG. 4 and from the right inFIG. 4 roughly along the line A-A in FIG. 6, the alignment means onlysuggested in FIG. 4 formed by the first housing part in the form of analignment groove for the light guide being clearly visible;

FIG. 6 shows a schematic plan view similarly to FIG. 11 of a componentaccording to FIG. 5 on a terminal sheet;

FIG. 7 shows a flow chart of the method as claimed in the invention forproducing an optoelectronic transmitter or receiver or transceiver;

FIG. 8 schematically shows analogously to FIG. 3 a transceiver with itsschematically shown light transmission links;

FIG. 9 is similar to FIG. 8, but shows an electrooptical transmitter;

FIG. 10 is similar to FIG. 8, but shows an electrooptical receiver;

FIG. 11 is a perspective plan view of an optoelectronic component madeas claimed in the invention, for example a transmitter, a receiver or atransceiver according to FIGS. 3 to 10; and

FIG. 12 shows the component of FIG. 11 from another perspective;

FIGS. 13 and 14 schematically show the invention with two reflectionsurfaces, formed by the optoelectronic component and its coupling means;

FIG. 15 shows a schematic view of the beam progression for a receivingbeam and a sending beam similar to FIGS. 13 and 14;

FIG. 16 shows schematic views similar to FIGS. 11 and 12, but here therebeing two reflection surfaces at a time, formed by the componenthousing.

FIG. 17 shows in general an optoelectronic component 20 (for short:component) 10 as claimed in the invention with an optoelectronic housingwhich can also be called a capsule, the housing and the capsule 9enclose at least one optical element 17 and optionally others. Couplingmeans 300 provide for an efficient connection or coupling between theoptical element 17 and a light guide (for example a glass fiber) 12which interacts with it. As claimed in the invention the coupling means300 are provided by a coupling structure, especially by the shape orexecution of the housing 9 such that at the same time optical couplingby optical coupling means 301 and mechanical coupling and alignment bymechanical coupling/alignment means 302 between the optical element 17and the light guide 12 are achieved. The coupling means 300 cause a 90°change in the optical path and a passive alignment of all elements,especially of the optical element 17 and the light guide 12 of thecomponent 10.

The housing 9 consists essentially of two housing parts, a first housingpart 1 and a second housing part 14 which bears the optical element 17.The first housing part 11 forms essentially the coupling means 300 whichon the one hand produce the optical connection (an optical transmissionlink) between the light guide 12 and the optical element 17 (by theoptical coupling means 301) and the alignment (by the mechanicalcoupling/alignment means 302) for the light guide 12, especially itsinlet/outlet surface 24, 25.

The second housing part 14 can be a carrier and specifically preferablyas shown in the form of a lead frame (substrate) 14. The optical element17 is connected by wire bonds 21 to the conductors of the second housingpart 14 in order in this way, as shown in FIGS. 3-6, to produce anelectrical connection for example to an ASIC 13 which is likewiselocated on the second housing part 14. The ASIC and possibly the opticalelement 17 could also be mounted with a flip-chip method.

By a method of encapsulation, especially of overmolding (or anothermethod), as claimed in the invention the first housing part 11consisting of a highly transparent plastic material 30 is formed andconnected to another material, specifically the material of the secondhousing part 14 by the overmolding injection method. The first housingpart 11 with the second housing part 14 which bears the optical element17 forms the optoelectronic component 10.

The first, especially overmold housing part 11 and the second housingpart 14, i.e. form the housing when they encompass an optical element17, a capsule, i.e. an optoelectronic semiconductor housing or anoptoelectronic semiconductor package.

The coupling means 300 and the mechanical coupling/alignment mean 302furthermore form, as clearly shown in FIG. 5, a light guide alignmentgroove or fiber alignment groove 20 for accommodating the light guide12. The groove in the illustrated exemplary embodiment is formed by twoobliquely running side walls 210, 220 and a lower wall 230. The fiberalignment groove 20 furthermore has a rear wall 240.

FIG. 1 therefore in general shows an optical component 10 which,depending on how the optical element 17 is made, can operate as atransceiver 110 as illustrated in FIG. 8, as a transmitter 120 asillustrated in FIG. 9 or as a receiver 130 as illustrated in FIG. 10,and there can be electrical circuits, for example an ASIC 13, whichinteroperate with the optical elements 170, 171, 172. The ASIC 13 isconnected by wire bonds or connecting wires 22, 23 to conductors in thesecond housing part 14. The optical element 17 is also connected to aconductor of the second housing part 14.

In the case of a transceiver 110 (compare FIGS. 3 and 8) the opticalelement 170 comprises both a transmitter and also a receiver and isconnected to the optical fiber 12 via a sending transmission path orsending beams 1 and a receiving transmission path or receiving beams 2.In the case of FIG. 9 the optical component is a transmitter or sender120 and as the optical element has an optical transmitting element 171(for example a VCSEL) which is connected to the light guide 12 via asending beam 1. The optical component 130 in FIG. 10 is a receiver 120,the optical element being for example a photodiode 172 which receives areceiving beam 2 which comes from the light guide 12.

It should be noted regarding FIG. 2 that here the two housing parts,i.e. the first housing part 11 and the second housing part 14, areclearly shown.

In the following the invention is described especially with reference toFIGS. 3 to 7 and 11 and 12, especially with respect to the fact that theoptical component is a transceiver 110 which can be advantageously usedin a USB 3x plug-in connector as claimed in the invention and especiallyin a socket of a transmitting/receiving apparatus which via acorresponding cable which also has light guides is connected to anotherapparatus which likewise has a corresponding socket.

FIG. 3 shows that the transceiver 110 as claimed in the invention isfundamentally structured such that the optical component 10 according toFIG. 1 is replaced here by the optical element 170 which comprises atransmitting apparatus and a receiving apparatus; this is not shown inparticular in FIG. 3.

Furthermore, as in the general case of FIG. 1, the plastic material,especially the overmold material 30, forms the coupling means 300between the optical element 170 and the light guide 12. The couplingmeans 300, as mentioned, have optical coupling means 301 and mechanicalcoupling means 302. The optical coupling means 301 form a reflector witha reflection surface 321, preferably in the form of a conical mirrorwith internal total reflection by the material 30 on the interface tothe air. The reflection surface 321 is made such that both the opticaltransmitting beams and also the optical receiving beams are efficientlydeflected by the reflection surface 321.

As indicated in FIGS. 4 and 5, the first housing part 11 and the secondhousing part 14 each have a longitudinal extension on the order of 2.5mm and the width is roughly 2.1 mm. Due to these small dimensions, theuse of a component 10 as claimed in the invention which is made as anoptoelectronic transceiver 110 is advantageous especially in theformation of a socket for USB 3x connections since the optoelectronictransceiver can be used together also with the existing USB 3.0 socketsand the USB 2.0 sockets which do not provide any optical transmission(backward compatibility).

As is shown in FIG. 4, the beam 1 which has been emitted from theoptical transmitting/receiving element 170, for example in thetransmission operating mode from a VCSEL 170 a, is reflected from thereflection surface 321 of a reflector formed by the housing part 11,which surface has been formed by the first housing part 30, and in doingso is collimated and then is incident essentially vertically on theinput end face 24 of the optical fiber 12 in order to be relayed by it.The optical fibers or the light guide 12 can be a single mode ormultimode light guide.

Therefore as claimed in the invention the optical component 10 and inthe case of FIGS. 3-8 and 11 and 12 the entire optoelectronictransceiver 110 are formed by the first housing part together with thesecond housing part which bears the optical element and circuits. Herethe optical fiber alignment and the preferably 90° beam deflection andcollimation are integrally achieved by the first housing part 11,preferably the overmold housing part and the second housing part 14 ofthe transceiver 110.

The optoelectronic semiconductor package therefore comprises the firsthousing part 11 and the second housing part, for example the lead frame14, then together with a driver and/or a receiver as well as an ASIC,the optical component 10, in the case of FIG. 3 the optical transceiver110, being formed.

The lead frame 14 is typically a metallic punched part on which thechips, such as for example the optical element 170; 170 a and the ASIC13 are fastened by die bonds 124 and with which wire bonds 21-23 makecontact. After bonding, the lead frame 14 is typically coated with aduroplastic and its terminal legs are punched free and optionallyangled. The separate coating with a duroplastic can be omitted asclaimed in the invention.

FIG. 6 shows a schematic plan view of the arrangement according to FIG.4. In the initial punching of the lead frame 14 as claimed in theinvention two or more alignment openings or holes 50, 51, 52 are punchedout near the fastening region of the optical element 170. Using a diebonder the optical element 170 is arranged with high precision at apredetermined location with respect to the alignment openings 50-52.Thereupon the component carrier which is made as a lead frame 14 isespecially “overrmolded”, i.e. coated with the overmold material 30 ofthe housing part 11, as a result of which the overmold material 30 orthe overmold housing part 11 is aligned with the component carrier 14,preferably in the form of the lead frame 14 using the alignment openings50-52. There are also possible alternative “overmolding” technologies,for example stamping/embossing, UV methods (for example similar to thinfusion), but with the focus on “transfer overmolding”.

The tolerance chain for the characteristic of the optical radiationbetween the optical element 170 and the light guide or the optical fiber12 is therefore the following: the placement accuracy (of the chip whichforms the optical element 17 or 170 or 171 or 172) and the alignmentaccuracy of the overmold housing part 11+mold material quality must beconsidered.

Since the fiber alignment feature lies in the overmold housing part (orthe mold material) itself, only the mold tooling influences the moldrepeatability and the alignment accuracy with the reflection surface 32and 321 in the case of the transceiver 110.

The steps as claimed in the invention for producing the electroopticaltransceiver 110 as claimed in the invention and its coupling means areshown in FIG. 5.

In step 70 the lead frame 14 is prepared and in step 71 thecorresponding printed conductors are punched and the lead frame 14 isoptionally subjected to a bending process. In step 72 the lead frame 14is plated for example with gold, then in step 73 the ASIC 75 beingfastened to the lead frame 14 by a conductive epoxy resin by means ofdie bonding 24. In step 76, likewise using the conductive epoxy resin,the precise fastening of the optical element 170, for example a VCSEL,as shown in FIG. 4, or a photodiode which is not shown takes place.

After the step 76 of precise alignment, in step 77 the wire bonds, forexample 21, 22, 23, are attached.

Step 81 is the overmold method step. In this step 81 the overmoldmaterial (mold compound) which is kept available in step 78 is injectedvia the lead frame 14 with the optical element 17 or 170 and ASIC 13mounted on it, specifically with formation of an internal reflectionmirror with the reflection surface 321, preferably of an internalconical total reflection mirror with the reflection surface 32.

In step 84 a punch/bend detachment takes place in the production of thetransceiver 110 on a conveyor belt.

In step 85 the functions of the optical transceiver 110 are tested. Instep 86 the final assembly for the light guide 12 which was prepared instep 79 is undertaken, optionally an additional metal housing which hasbeen made available in step 80 and 83 being attached in step 86, likethe likewise prepared metal after steps 82 and 83 in final assembly.

FIGS. 11 and 12 show outside views of the transceiver 110 which is shownand described in FIGS. 3-7.

Let it be noted that instead of “overmolding” also the word“encapsulation” could be used in order to express the fact that othermolding methods can also be used. A bidirectional version is alsopossible.

Based on the aforementioned, the invention calls for an optoelectroniccomponent 100 which in addition to a reflector D has another conicalreflector B which is likewise formed by the optical coupling means 30.The left-hand reflector A embodied in FIGS. 13-17 is an additionalfeature of this invention. The additional reflector A, as shown in FIGS.13-17, is located downstream of the reflector C. The combination of thetwo reflectors works as explained below.

The two reflectors A, C are formed by the above described first housingpart 11 which is molded such that it forms the respective reflectionsurfaces x, y.

It is apparent that the receiver 172 receives the light entering throughthe optical fiber (optical fiber core) via the surface D. As a result ofinternal total reflection, the light is reflected away on the conicalsurface C and in this way is turned by 90° and roughly collimated. It isthen incident on the photodiode and the photodetector 672 underneath thereflector C, within the first housing part 11 especially of the overmoldcompound or the overmold plastic. The emitter 171 on the other hand(VCSEL) emits the light which is incident on the conical reflectorsurface A. The beam is turned (by less than 90°) and collimated in partas a result of internal total reflection. The beam emerges from thefirst housing part 11, especially the overmold plastic, through thesurface B and again enters the housing part 11 through the conicalsurface C. C and D effectively form a spherical planar convex lens.

One noteworthy feature of the invention is that the VCSEL photodiodefeedover should be essentially zero, and potential contributions onlyfrom scattering as a result of the surface roughness could occur.Reference is made to the following important points.

In the prior art the “transparent transfer overmolding” is known forexample in the field of LED packaging.

In the invention it is advantageous that the overmold offers aprotection function in the sense of a housing, specifically relative tomechanical forces and ambient influences such as for example water.

With respect to the production method, it should be noted that the “diebond” and then “wire bond” of the ASIC and possibly also the OEcomponents could be mounted in a flip-chip method. Furthermore insteadof a “lead frame” also other substrate materials such as for exampleFR-4 or ceramic could be used.

It should be emphasized that the invention relates not only to onetransmission direction, but, as explained, also two optoelectroniccomponents and one or two ASICs, furthermore two mirrors and two fibertrenches can be used.

Although the focus is on the “transfer overmolding” there are possiblealternative “overmolding” technologies, for example stamping/embossingas well as UV methods.

In particular it should be noted for the invention especially accordingto FIGS. 13 to 17 that the invention achieves the miniaturization of theoptoelectronic transceiver and also the number and size of thecomponents in an optoelectronic transceiver are reduced. Essentially theoptical transceiver comprises an optical transmitter 171, an opticalreceiver 172 and coupling means 300 consisting of a first and secondoptical lens, compare FIG. 15, for changing/deflecting optical paths ofon the one hand optical output signals of the optical transmitter 171 toa connectable optical light guide 12 and on the other hand of inputsignals of the same light guide 12 to the receiver 172, in particular asclaimed in the invention the first lens having a concave reflectionsurface which lies inside in the coupling means 300 for signals of theoptical transmitter and the second lens forming a concave reflectionsurface which lies inside for incoming signals via a convex transmissionsurface which lies outside for outgoing signals of the opticaltransmitter. The position of the lenses which have been formed in thisway to one another is provided such that efficient transmission both ofthe transmitting and also the receiving signals takes place. Thematerial which forms the coupling means preferably has an index ofrefraction of >1.3. Furthermore the inner surface of the second lens ismade with a radius of curvature such that the condition of totalreflection is satisfied, and specifically with reference to the opticalpaths of optical signals which are incident on the interface from thelight guide 12. Furthermore material with an index of refraction of >1.3can be used, the inner surface of the first lens being made with aradius of curvature such that the condition of total reflection issatisfied with respect to optical paths of optical signals which areincident on the interface from the transmitter 171.

In the production method as claimed in the invention, the alignment ofthe photoelements is already ensured in the production process, thedeflection of the light being achieved by the coating, i.e. the overmoldmaterial. In this way, a finished unit closed in itself is produced inwhich the light reflecting angle always occurs vertically or in thedirection of the optical axis regardless of the location and position ofthe circuit board. Moreover the mirror effect is intensified or improvedby the mirror curve, also called “conic mirror”, being made such that nopoint light beams, but rather a spot of light is achieved and thus iscoupled reliably into the fiber optics.

Regarding the invention shown especially in FIGS. 13 to 17, it should benoted that the two reflectors work as follows. The light which entersthe overmold material from an optical fiber travels to the receiverthrough the surface D. As a result of internal total reflection thelight is reflected from the conical surface C and thus is deflected by90° and roughly collimated. It is then incident on a photodiode which islocated underneath the reflector within the overmold material 30. Withregard to the emitter, the light emitted from a VCSL will be incident ona conical reflector surface A. Here the beam is turned by (less than90°) and partially collimated, and specifically as a result of theinternal total reflection. The beam then emerges from the overmoldmaterial through the surface B and enters again, specifically throughthe conical surface C, and finally emerges through the surface D. Asalready mentioned, C and D effectively form an eccentric asphericalplanar convex lens.

It should be noted that instead of “overmolding” also the word“encapsulation” could be used in order to express the fact that othermolding methods can also be used. A bidirectional version is alsopossible.

Based on the aforementioned, this invention calls in addition foranother conical reflector next to the reflector as was described in theaforementioned. In FIGS. 13-17 the left-hand reflector A embodies anadditional feature of this invention. The additional reflector A, asshown in FIG. 5, is located downstream of the reflector C. Thecombination of the two reflectors works as explained below.

The two reflectors are formed by the above described first housing partwhich is molded such that it forms the respective reflection surfaces Xand Y.

It is apparent that the receiver receives the light entering through theoptical fiber (core) via the surface D. As a result of the internaltotal reflection, the light is reflected away on the conical surface Cand in this way turned by 90° and roughly collimated. It is thenincident on the photodiode and the photodetector underneath thereflector, specifically within the first housing part especially of theovermold compound or the overmold plastic. The emitter on the other hand(VCSEL) emits the light which is incident on the conical reflectorsurface A. The beam is turned (by less than 90°) and collimated in partas a result of internal total reflection. The beam emerges from thefirst housing part, especially the overmold plastic, through the surfaceB and again enters through the conical surface C and finally emergesthrough the surface D, C and D effectively forming a spherical planarconvex lens.

One noteworthy feature of the invention is that the VCSEL photodiodefeedover should be essentially zero, and potential contributions onlyfrom scattering as a result of the surface roughness could occur. Thisis not necessarily the case in other implementations where for exampletemperature stabilization can be necessary to avoid feedover.

It should be noted that the geometry shown in FIG. 15 is only onepossible implementation. For example, the surface A in some cases couldbe made as a flat tilted surface. The surfaces B and D could be providedwith orientations directed to the outside, either to facilitate releaseof the molded first housing part or to act as an optical prism.

The precise choice of the geometry depends on the core diameter and thenumerical aperture of the optical fiber. More exactly, the numericalaperture dictates the maximum angle of incidence of the beam on thefiber. Therefore the following applies: The smaller the numericalaperture, the more accurate the control or monitoring of the reflectorgeometry during assembly.

The invention claimed is:
 1. An optoelectronic transceiver which has thefollowing: a) an optical transmitter, b) an optical receiver, c)coupling means consisting of a first and second optical lens made withoptically active interfaces for changing/deflecting optical paths of onthe one hand optical output signals A of the optical transmitter to aconnectable optical light guide and on the other hand of input signals Eof the same light guide to the receiver, characterized in that the firstlens has a concave reflection surface which lies inside in the couplingmeans for signals of the optical transmitter and the second lens has aconvex transmission surface which lies outside for outgoing signals ofthe optical transmitter and a concave reflection surface which liesinside for incoming signals.
 2. The transceiver as claimed in claim 1,wherein the material which forms the coupling means defines or fixes theposition of the lenses to one another.
 3. The transceiver as claimed inclaim 1, wherein the material has an index of refraction of >1.3 and theinner surface of the second lens is made with a radius of curvature suchthat the condition of total reflection is satisfied with reference tothe optical paths of optical signals which are incident on the interfacefrom the light guide.
 4. The transceiver as claimed in claim 1, whereinthe material which has an index of refraction of >1.3 [sic], and theinner surface of the first lens is made with a radius of curvature suchthat the condition of total reflection is satisfied with respect tooptical paths of optical signals which are incident on the interfacefrom the transmitter.
 5. An optoelectronic transceiver which has thefollowing: a) an electrical-optical transmitter which emits opticalsignals to an input/output end face of a light guide and/or b) anoptical-electrical receiver which receives optical signals and convertsthem into electronic signals, c) a component carrier on which thetransmitter and/or receiver is/are located, and one housing part whichsurrounds the transmitter and/or receiver and which has coupling meanswhich form optical coupling means and mechanical coupling means, theoptical coupling means routing or coupling the optical signals comingfrom the electrical-optical transmitter to the input end face of thelight guide and/or routing or coupling the optical beams emerging fromthe input/output end face of the light guide to the optical-electricalreceiver, the mechanical alignment means aligning the light guide withrespect to the electrical-optical transmitter and/or the opticalelectrical receiver for efficient signal transmission, the opticalcoupling means forming a first reflection interface for the opticalsignals coming from the transmitter, a second reflection interface forthe optical signals emerging from the light guide and furthermore afirst and second transmitter surface for the optical signals coming fromthe transmitter.
 6. The optoelectronic transceiver as claimed in claim5, characterized in that the housing part is formed preferably by anovermold injection method and is connected to the component carrier orits material by the injection method.
 7. The optoelectronic transceiveras claimed in claim 5, wherein the housing part forms a mechanicalalignment means which aligns one light guide and thus the input/outputsurface of the light guide with the optical signals which have beenreflected from the reflection interfaces.
 8. The optoelectronictransceiver as claimed in claim 5, that the plastic material, especiallythe overmold material is transparent and has an index of refractionn>1.3, preferably n=1.5.
 9. The optoelectronic transceiver as claimed inclaim 5, that the mechanical coupling means is made in the form ofalignment means for the light guide in the housing part, preferably thealignment means being made in the form of a V-groove which preferablyhas side surfaces which run obliquely to one another.
 10. Theoptoelectronic transceiver as claimed in claim 6, wherein the plasticmaterial forms a reflection interface on the transition between theplastic material and air above the optical transmitter such that thelight emerging from the optical transmitter is reflected by the firstand second transmission surface onto the input end face of the lightguide, and specifically is preferably collimated.
 11. The optoelectronictransceiver as claimed in claim 6, wherein the housing part consistsmade [sic] of highly transparent plastic, and when the first housingpart is formed with a material of a second housing part, it assumes amechanical connection, the second housing part being a carrier for anoptical element and optionally other components or electrical circuits.12. The optoelectronic transceiver as claimed in claim 6, wherein thecomponent carrier is a punched component carrier, preferably a leadframe.
 13. The optoelectronic transceiver as claimed in claim 6, whereinthe overmold plastic material which forms the housing part, tworeflectors or reflection mirrors which each form one reflection surfacefor the light which can be transmitted between the optical elementspositioned on the component carrier and the entry end face of one lightguide (and optionally vice versa) [sic], preferably the reflectionmirrors which form the reflection surfaces being an internal conicaltotal reflection mirror, the plastic on its interface to the ambient airforming the reflection mirror as a result of the transition from theplastic material with a higher index of refraction to the air with anindex of refraction of 1.